Using infrared and differential interferometry techniques, a line scan camera is used to optically image the Bump area on the COG and FOG of the liquid crystal panel. The images are analyzed using traditional image algorithms and AI deep learning algorithms to ultimately confirm whether the target detection object is qualified. Used to detect the indentation of ACF conductive particles and bonding foreign objects on the COG and FOG parts of the LCD panel bonding section, including the quantity, distribution, indentation strength, offset, and various foreign objects of the conductive particles.

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  Differential interference microscopy imaging

  DIC differential interference fiber imaging - clearer and stronger stereoscopic effect.

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  Fast laser autofocus

  Laser autofocus can solve the problem of warping of the measured object.

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  High speed motion stable workbench

  The I-shaped seismic scanning mechanism and marble seismic platform ensure smooth operation.

   

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  AI deep learning re evaluation

  Using AI artificial intelligence systems based on deep learning for re evaluation, reducing false alarm rates and improving detection accuracy.